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Wafer dicing

Wafer dicing is an essential step in the manufacturing of integrated circuits. It is the process by which individual chips are diced from a wafer of semiconductor following the processing of the whole wafer. The dicing process can involve scribing and breaking, and is traditionally performed by mechanical sawing. All methods are typically automated to ensure precision and accuracy.

Wafer dicing is not an easy process. As the wafer itself is a fragile material, the traditional mechanical cutting process can result in wafers cracking and chip scrapping. On the other hand, laser cutting of semiconductor wafers avoid the probability of mechanical failure of wafers with its high efficiency, high precision and non-contact processing method. 

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